To obtain access to full text of journal and articles you must register!
- Article name
- SEPARATION OF ORGANIC LIGHT-EMITTING DIODES ON A SILICON SUBSTRATE BY LASER CONTROLLED THERMOCREAKING
- Authors
- Kondratenko V. S., , vsk1950@mail.ru, Moscow State University of Instrument Engineering and Computer Science, Russia
Borisovsky V. E., , borisovskiyi_ve@mgupi.ru, Moscow State University of Instrument Engineering and Computer Science, Moscow, Russia
Ivanov V. I., , ivi061@gmail.com, Moscow State University of Instrument Engineering and Computer Science, Moscow, Russia
- Keywords
- laser controlled thermocracking (LCT) / organic light-emitting diodes (OLED) / silicon / silicon wafers cutting into chips
- Year
- 2014 Issue 2 Pages 76 - 81
- Code EDN
- Code DOI
- Abstract
- The work is aimed at introduction of high efficiency of technological precision cutting process silicon wafers in the production of OLED microdisplays. This process based on the application of advanced Russian method of laser controlled thermocracking (LCT). The work demonstrates the possibility of using LCT in OLEDs technology. The article uses a laser system RT-350 for cutting semiconductor device wafers into chips by LCT method.
- Text
- To obtain access to full text of journal and articles you must register!
- Buy
