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- Article name
- 3D MID TECHNOLOGY OF SYNTHESIS OF BULK ELECTRONIC MEANS
- Authors
- Arabov D. A., , daler.ai@gmail.com, Bauman Moscow State Technical University, Moscow, Russia
Vlasov D. S., , vlaso2017@yandex.ru, Bauman Moscow State Technical University, Moscow, Russia
- Keywords
- electronics assembly / 3D-MID technology / three-dimensional
- Year
- 2018 Issue 4 Pages 36 - 41
- Code EDN
- Code DOI
- Abstract
- The article considers the prospects of production of spatial elements of electronic means of technologies of volumetric conductors based on 3D-MID technologies. The analysis of the market is made, the main areas of application of 3D-MID technologies are classified. The typical technological process of obtaining three-dimensional conductors for electronic switching structures is analyzed. The basic materials used for 3D MID are considered. The comparison of products obtained by conventional technology on the printed circuit Board and products obtained by 3D-MID technology. The method of synthesis of volume elements of electronic means using 3D-MID technology tools is proposed.
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