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- Article name
- Investigation of influence of variative preparation of carbide plates on nucleation density, morphology and adhesion characteristics of diamond film
- Authors
- OGLEZNEVA S. A., , director@pm.pstu.ac.ru, Perm National Research Polytechnic University, Perm, Russia
VOKHMYANIN D. S., , d_voh@me.com, Perm National Research Polytechnic University, Perm, Russia
POZDEEVA T. Yu., , pozdeevatu@gmail.com, Perm National Research Polytechnic University, Perm, Russia
- Keywords
- diamond films / nucleation / crystallinity / copper sublayer / hard alloy / pre-treatment / CVD deposition
- Year
- 2019 Issue 1 Pages 12 - 17
- Code EDN
- Code DOI
- Abstract
- The effect of variable surface treatment of carbide-tipped WC-Co plates on origin, structure and phase composition of diamond films that were acquired using CVD method with the use of copper sublayer and UDD suspension was investigated. It is determined that a continuous diamond film is formed on a sublayer of copper or with a combination of a copper sublayer and UDD. It is found that the structure of a diamond film consists of cauliflower globules using a copper underlayer, UDD and their co-deposition on the surface of WC-Co. A homogeneous diamond film, with directed growth in the (100) plane, is formed by preparing the surface in four stages: deposition of the copper sublayer followed by etching in nitric acid, subsequent treatment in the UDD slurry and re-deposition of the Cu sublayer onto the WC-Co surface. The Raman spectroscopy established that regardless of the parameters of the surface treatment, a diamond phase (1332 cm-1) is formed however the position of the diamond peak is determined by the parameters of the variable surface treatment. The crystalline quality of the acquired coatings through the ration of integral sp2/sp3 intensities using Raman spectroscopy. The minimum content of graphite impurities (sp2/sp3 = 62) was obtained by processing the copper sublayer in UDD, and the maximum content (sp2/sp3 = 105) when treating the WC-Co surface only in UDD. The best adhesion of the film to the substrate was obtained by using a copper sublayer and with a three-stage preparation of the surface of carbide plates.
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