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- Article name
- Thermophysical calculations and design engineering of multilayered structures of microelectronic devices
- Authors
- Pogalov A. I., , dtm@miee.ru, Moscow Institute of Electronic Technology (Technical University), Moscow, Russia
Blinov G. A., , mg@miee.ru, Moscow Institute of Electronic Technology (Technical University), Moscow, Russia
CHUGUNOV E. Yu., , , National Research University of Electronic Technology, Moscow, Russia
- Keywords
- three-dimensional multichip microelectronic device / thermal burdening of the devices / strength of multilayered structures / heat sink in the microelectronic devices
- Year
- 2012 Issue 4 Pages 3 - 7
- Code EDN
- Code DOI
- Abstract
- The thermal burdening of the three-dimensional multichip microelectronic devices with built-in flat heat sink, made as copper or aluminum heat-conducting bus, has been researched. The regularities of the heat sink material, the thickness of polyimide films, the occurrence windows for heat transfer in polyimide films to the chips overheat temperature in a highly integrated devices has been established. The recommendations of designing microelectronic devices with the effective heat sink have been developed.
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