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- Article name
- DEVELOPMENT UNCASED MULTICONNECTION INTEGRATED CIRCUITS WITH BALL PINOUTS ON FLEXIBLE BOARD
- Authors
- Pogalov A. I., , dtm@miee.ru, Moscow Institute of Electronic Technology (Technical University), Moscow, Russia
Blinov G. A., , mg@miee.ru, Moscow Institute of Electronic Technology (Technical University), Moscow, Russia
Dolgovykh Yu. G., , wise85@bk.ru, Moscow Institute of Electronic Technology (Technical University), Moscow, Russia
- Keywords
- design / technology / uncased integrated circuits / ball pinouts / flexible board / thermal strength / modeling
- Year
- 2011 Issue 4 Pages 38 - 43
- Code EDN
- Code DOI
- Abstract
- The technology of manufacture of the universal uncased multiconnection integrated circuits with ball pinouts on flexible board is shown. The finite-element models are developed, the thermal strength products are investigated, recommendations for the design are offered.
- Text
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