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- Article name
- Stress-strain state and thermal burdening of multilayered adhesive bondings of multichip micromodules
- Authors
- Pogalov A. I., , dtm@miee.ru, Moscow Institute of Electronic Technology (Technical University), Moscow, Russia
Blinov G. A., , mg@miee.ru, Moscow Institute of Electronic Technology (Technical University), Moscow, Russia
CHUGUNOV E. Yu., , , National Research University of Electronic Technology, Moscow, Russia
- Keywords
- multichip micromodule / adhesive bondings / stress-strain state of structures / thermal burdening of the multichip modules
- Year
- 2013 Issue 2 Pages 18 - 22
- Code EDN
- Code DOI
- Abstract
- The stress-strain state and thermal burdenings of materials of multichip micromodules have been researched. The influence of grades and properties of adhesive materials used in the assembly of multichip modules to the strength and thermal resistance of multilayered structures of modules has been established. The recommendations for the use of adhesives to create of multilayered compounds in the structures of multichip modules with the effective heat sink and reliability have been developed.
- Text
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