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- Article name
- Explosive method of fabricating the metallization systems
- Authors
- Klimanov E. A., , orion@orion-ir.ru, Orion R&P Association, 46/2 Enthusiasts road, Moscow, 111402, Russia
Liseykin V. P., , orion@orion-ir.ru, Orion R&P Association, 46/2 Enthusiasts road, Moscow, 111402, Russia
Sednev M. V., , orion@orion-ir.ru, Orion R&P Association, 46/2 Enthusiasts road, Moscow, 111402, Russia
Akimov V. M., , orion@orion-ir.ru, Orion Research-and-Production Association, 46/2 Enthusiast road, Moscow, 111123, Russia
Mikertumyants A. R., , orion@orion-ir.ru, Orion Research-and-Production Association, 46/2 Enthusiast road, Moscow, 111123, Russia
Sergeev V. V., , orion@orion-ir.ru, Orion Research-and-Production Association, 46/2 Enthusiast road, Moscow, 111123, Russia
Shelobolin I. A., , orion@orion-ir.ru, Orion Research-and-Production Association, 46/2 Enthusiast road, Moscow, 111123, Russia
- Keywords
- systems / metallization / forming / current-carrying systems / highly-integrated chip
- Year
- 2010 Issue 4 Pages 99 - 101
- Code EDN
- Code DOI
- Abstract
- Fabricating the systems and the microcontacts of highly-integrated chips has been obtained by an explosive method.
- Text
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